Xbox One Hotchips revisited and XBox One Speculative discussion
- Thread starter puresoul002
- Start date
I am not aware of any limitations though there might be some of a natural order such as playing an online game and streaming a movie online. Not sure.
Phil Spencer said he can play his Forza while using Skype at the same time listening to his music.
What does that tell you?
What does that tell you?
I don't consider it the same as playing candy crush or something like that........you know...an app that is a game.
I thought Skype was what you used for your game chat for xbox one so it was a given that that would work with your game.
Lol. That's a terrible idea. In any case, I would say "no", since a game is a game regardless of how simple it is.
That Phil Spencer can play Forza along side Skype while listening to music.
In that case, let's say yes, but the major snap app is going to have the focus, and any game not in focus might very well go into a paused state as most likely to programmed to do. Sort of like a game today on the 360 when pulling up the guide.
Good guess Kinectv2 is a great deal more complex than it's predecessor. It's plugged through the X1, and has it's own SoC power needs. The original Xbox 360 PSU's output was 203. The X1's PSU's is 253, and it's physically larger in size.
Of course that leaves 153w left over to the output, and Kinect isn't going to need all of that. Maybe about a third of that if it's draw is healthy. I wouldn't stress over the numbers too much. It'll make sense when it's all explained.
Thank you for logic and reason. Or, you could be wrong and there are two SoCs with 2 GPUs each and not enough power to run the BR drive.
Yes you can play a game and snap an app..they talked about it a few times, about getting stuck in a game and snapping the YouTube app or IE and looking for help. I think they said you can snap anything other than a game snapped with a game.
Some info regarding DDR3/DDR4 Custom timing & TSV what make me think about this is actually
some one called themselves SuperDAE on TXB on 2012, when he claimed that MS using custom DDR3, that can use unsused cycle, infact he said per pin can transfer 1333 MB/sec instead Mbit , etc, same like you and others i just laughed, until we found x1 is partitioned per 2GB.
I am not discussing about BW, i want to share the source i found: let all of you draw your own conclusion
1. A. Samsung DDR3 off die using TSV (Aug 2011)
!!! (look closely at the photo, especially the chip packaging)( it is the same as DDR3 without TSV)
http://www.hitechreview.com/it-prod...3-rdimm-by-3d-chip-stacking-technology/29224/
http://www.xbitlabs.com/news/memory...RDIMM_with_Through_Silicon_Via_Packaging.html
Samsung Green Memory 30nm using TSV (look closely how the Chip packaging is the same as standard DDR3)
2. The DDR3/DDR4 3D Stacking Micron explanation Video
http://www.techpowerup.com/157096/ddr4-may-use-3d-stacking-technology.html
Look at the video
Part of video Explanation (how they can use same packaging to transfer more data from several dies 3d stacked)
""The 3DS technology resolves this problem by allowing the 3DS device to accept Read commands to different ranks, which keeps the data bus full by eliminating these single-cycle gaps, as Aftab Farooqi of Micron Technology explains:"
"In the second case, we are observing how data is continuous when the system issues consecutive Read commands on the same rank. A 3DS-optimized system will similarly take advantage of this tighter timing and be able to see improved data bus utilization and bandwidth when reading from different banks."
3. Samsung Microsoft (Sep 2011) Joint Collaboration on Grenn memory, what interesting is on this joint annoucement, it only said 30nm, new samsung type, but not saying about it is actually new Samsung 3D type, as Point 1, it is actually MS use Point 1
**) regarding Kinect 2 it will be <25W, K1 = 10-15W, Also Kinect 2.0 use new better node process, there is no motorized unit
***) the mainboard have 5 Coiltronics + 2 smaller choke, 5 Of it are for CPU/Gfx core, u can see, that it means 75% of the power is for CPU/Gfx core MainChip
** Updated 1st post to reflect some info
some one called themselves SuperDAE on TXB on 2012, when he claimed that MS using custom DDR3, that can use unsused cycle, infact he said per pin can transfer 1333 MB/sec instead Mbit , etc, same like you and others i just laughed, until we found x1 is partitioned per 2GB.
I am not discussing about BW, i want to share the source i found: let all of you draw your own conclusion
1. A. Samsung DDR3 off die using TSV (Aug 2011)
!!! (look closely at the photo, especially the chip packaging)( it is the same as DDR3 without TSV)
http://www.hitechreview.com/it-prod...3-rdimm-by-3d-chip-stacking-technology/29224/
http://www.xbitlabs.com/news/memory...RDIMM_with_Through_Silicon_Via_Packaging.html
Samsung Green Memory 30nm using TSV (look closely how the Chip packaging is the same as standard DDR3)
2. The DDR3/DDR4 3D Stacking Micron explanation Video
http://www.techpowerup.com/157096/ddr4-may-use-3d-stacking-technology.html
Look at the video
Part of video Explanation (how they can use same packaging to transfer more data from several dies 3d stacked)
""The 3DS technology resolves this problem by allowing the 3DS device to accept Read commands to different ranks, which keeps the data bus full by eliminating these single-cycle gaps, as Aftab Farooqi of Micron Technology explains:"
"In the second case, we are observing how data is continuous when the system issues consecutive Read commands on the same rank. A 3DS-optimized system will similarly take advantage of this tighter timing and be able to see improved data bus utilization and bandwidth when reading from different banks."
3. Samsung Microsoft (Sep 2011) Joint Collaboration on Grenn memory, what interesting is on this joint annoucement, it only said 30nm, new samsung type, but not saying about it is actually new Samsung 3D type, as Point 1, it is actually MS use Point 1
**) regarding Kinect 2 it will be <25W, K1 = 10-15W, Also Kinect 2.0 use new better node process, there is no motorized unit
***) the mainboard have 5 Coiltronics + 2 smaller choke, 5 Of it are for CPU/Gfx core, u can see, that it means 75% of the power is for CPU/Gfx core MainChip
** Updated 1st post to reflect some info
here is some food for ya Puresoul02
http://wccftech.com/amd-live-webcast-generation-hawaii-gpu-volcanic-islands-gpu14-conference/
http://wccftech.com/amd-live-webcast-generation-hawaii-gpu-volcanic-islands-gpu14-conference/
It tells me Phil Spencer maybe a cocaine addicted multi-tasker...
I didn't create this, it has been floating around Neogaf for quite some time.
But man, every time puresoul posts it should be the only response allowed for epic comedy.
But man, every time puresoul posts it should be the only response allowed for epic comedy.
I know you didn't, saw it on GAF in response to Penello before. Was just saying..it needs to say Puresoul02 lol
Okay, who here is the resident GIF wizard and how much do I have to pay them to make this happen?
See? An Xbox dev came on Reddit and cleared it up. The X1 consumes 215wtts. So not even 240.
http://www.reddit.com/r/xboxone/comments/1mo17k/for_all_of_you_wanting_specs_on_the_power_supply/
http://www.reddit.com/r/xboxone/comments/1mo17k/for_all_of_you_wanting_specs_on_the_power_supply/
But...but...I have PROOF! Architecture diagrams I don't understand at all, cobbled together and altered where necessary, highlighted with MS Paint, and annotated with my rambling, incoherent wishful thinking! That's worth more in my book than actual statements by actual MS employees!
I think that guy is more than a dev, unless he is first party. He keeps using pronouns such as "our" and "we"